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The Processing of Titanium Clad Copper Parts

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The Processing of Titanium Clad Copper Parts

1.Our process mainly includes explosion cladding and rolling.

Explosion cladding

2.Explosion cladding is a unique, robust technology for welding plates together using the energy of an explosive detonation.

Explosion cladding manufacturing

3.Explosion cladding manufacturing:

a.Pre-clad: Plain material inspection → Grind mating surfaces → Assembly (Backer & Cladder)

The processing of Titanium Clad Copper Parts - SAM

b.Pre cladding assembly

The processing of Titanium Clad Copper Parts - SAM

Cladding and Base Metal Plates are positioned parallel with a preset separation distance. Explosive is on top.

c.Cladding:

The processing of Titanium Clad Copper Parts - SAM

Detonation sweeps across the plate at ~2000m/sec (2 & 3);

Essential variables are:

The processing of Titanium Clad Copper Parts - SAM

d.Post-clad:

The processing of Titanium Clad Copper Parts - SAM

Flattening and Cutting → Testing and Inspection (Ultrasonic testing)

4.Rolling

5.Straightening → Machining → Polishing

Conclusion

Thank you for reading our article and we hope it can help you learn how to process titanium clad copper parts well. If you want to know more about titanium clad copper parts and other refractory metals and alloys, we would like to advise you to visit Stanford Advanced Materials (SAM) for more information.

Stanford Advanced Materials (SAM) is a worldwide supplier of titanium products and has over two decades of experience in the manufacture and sale of titanium products, offering high-quality titanium and titanium clad copper parts to meet customers' R&D and production needs. As such, we are confident that SAM will be your favorite titanium-clad copper parts supplier and business partner.

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About the author

Chin Trento

Chin Trento holds a bachelor's degree in applied chemistry from the University of Illinois. His educational background gives him a broad base from which to approach many topics. He has been working with writing advanced materials for over four years at Stanford Advanced Materials (SAM). His main purpose in writing these articles is to provide a free, yet quality resource for readers. He welcomes feedback on typos, errors, or differences in opinion that readers come across.

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A Practical Guide to High-Dielectric-Constant Materials (Dk >25) for RF and Microwave Applications Radiopaque Tantalum Marker Bands Hit Tight ID/OD Tolerances in a Medical Implant Program 1mm OD Alumina Tube Supports Miniaturized Medical Device Assembly CoCrMo Alloy Wire with Tight Diameter Control for Medical Component Manufacturing Gold-Plated Polyimide Film for TEER Impedance Measurements in Microfluidic R&D

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