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  • ST0035 Platinum (Pt) Sputtering Target

    • ST0035 Platinum (Pt) Sputtering Target

    Catalog No. ST0035
    Composition Pt
    CAS Number 7440-06-4
    Purity ≥99%
    Shape Discs, or Custom-made
    Diameter 2", 3", 4", 5", 6", or customized
    Thickness 0.25", 0.125", or customized
    Bond Type Copper, or customized
    Synonyms Platinum Sputtering Target, Pt Target

    Stanford Advanced Materials (SAM) offers high-purity Platinum (Pt) Sputtering Targets (≥99%) engineered for demanding thin film deposition processes. Platinum's exceptional chemical stability and oxidation resistance make it the preferred choice for semiconductor manufacturing, microelectronics, and advanced research applications. Our Pt sputtering targets are manufactured via vacuum melting and precision machining to achieve fine-grain structure and high density, ensuring consistent sputtering performance and uniform film deposition. Available in standard disc geometries or custom configurations, with copper bonding options for optimized thermal management during DC sputtering.

    Related Products: Rhodium (Rh) Sputtering Target, Palladium (Pd) Sputtering Target, Iridium (Ir) Sputtering Target

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    Platinum (Pt) Sputtering Target
    Platinum (Pt) Sputtering Target
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    This Item
    ST0035 Platinum (Pt) Sputtering Target
    Add to List
    Composition
    Pt
    CAS Number
    7440-06-4
    Purity
    ≥99%
    Shape
    Discs, or Custom-made
    Diameter
    2", 3", 4", 5", 6", or customized
    Thickness
    0.25", 0.125", or customized
    Bond Type
    Copper, or customized
    Synonyms
    Platinum Sputtering Target, Pt Target
     
    NB0036 Niobium Target, Nb Target
    Add to List
    Add to Compare
    Dimensions
    Customized
    CAS Number
    7440-03-1
    Grade
    R04200 R04210
    Standard
    ASTM B393
    Form
    Target
    Purity
    ≥99.9%
     
    NBZ0047 Niobium Zirconium Alloy Sputtering Targets & Discs
    Add to List
    Add to Compare
    Material
    R4251 (Nb-1Zr) R4261 (Nb-1Zr)
    Surface finish
    Polished
    Dimensions
    Circular Targets Diameter 10-400 mm Thickness 2-28 mm
    Purity
    99.9% 99.95% 99.99%
     
    ST0334 Indium Tin Oxide (ITO) Sputtering Targets
    Add to List
    Add to Compare
    Material
    90% In2O3+10% SnO2 / 95% In2O3+5% SnO2
    Purity
    >=99.99%
    Density
    7.1g/cm3

    FAQ

    Q: What is the difference between Platinum and Pt sputtering targets?

    A: They are the same material. "Pt" is the chemical symbol for Platinum. Both terms refer to our high-purity platinum sputtering targets.

    Q: What is the lead time for a custom Platinum sputtering target?

    A: Typical lead time for custom sizes is 2-3 weeks after order confirmation. Standard disc sizes (2"-6") may ship sooner. Contact us for current stock status.

    Q: Do you recommend bonding Platinum targets to a backing plate?

    A: For DC sputtering at higher power densities, we recommend bonding to a copper backing plate using indium or elastomer to improve thermal management and prevent target cracking.

    Q: What is the difference between 99% and 99.99% purity Pt targets?

    A: 99% purity is suitable for most optical and decorative coatings. 99.99% (4N) purity is recommended for semiconductor and advanced research applications where trace elements can affect film performance.

    Q: Can you provide the typical sputtering rate for your Platinum target?

    A: Sputtering rates depend on your specific tool and parameters. Our technical team can provide reference rates based on your target size and power supply. Please include your system details with your inquiry.

    Related Products

    CatalogNo Shape Form
    ST10712 Rotary Target

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      Purity

      99.9%

      • 99.9%
      • 99.5%
      • 99.99%
      • 99.999%
      • Other
      Diameter

      2''

      • 2''
      • 3''
      • 4''
      • 5''
      • 6''
      • Other
      Thickness

      0.25''

      • 0.25''
      • 0.125''
      • All
      • Other
      Bonding

      Yes

      • Yes
      • No
      • Other
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