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ST0011 Copper (Cu) Sputtering Target

Catalog No. ST0011
Composition Cu
CAS Number 7440-50-8
Purity ≥99%
Shape Discs, or Custom-made
Diameter 2", 3", 4", 5", 6", or customized
Thickness 0.25", 0.125", or customized
Bond Type Copper, or customized

Stanford Advanced Materials is renowned for delivering superior materials engineered to meet the rigorous demands of modern technology. Our commitment to quality and innovation ensures that every Copper (Cu) Sputtering Target delivers outstanding performance and reliability in diverse high-tech applications.

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Copper (Cu) Sputtering Target
Copper (Cu) Sputtering Target
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This Item
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Composition
Cu
CAS Number
7440-50-8
Purity
≥99%
Shape
Discs, or Custom-made
Diameter
2", 3", 4", 5", 6", or customized
Thickness
0.25", 0.125", or customized
Bond Type
Copper, or customized
 
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Dimensions
Customized
CAS Number
7440-03-1
Grade
R04200 R04210
Standard
ASTM B393
Form
Target
Purity
≥99.9%
 
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Material
R4251 (Nb-1Zr) R4261 (Nb-1Zr)
Surface finish
Polished
Dimensions
Circular Targets Diameter 10-400 mm Thickness 2-28 mm
Purity
99.9% 99.95% 99.99%
 
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Material
90% In2O3+10% SnO2 / 95% In2O3+5% SnO2
Purity
>=99.99%
Density
7.1g/cm3

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United States

    Purity

    99.9%

    • 99.9%
    • 99.5%
    • 99.99%
    • 99.999%
    • Other
    Diameter

    2''

    • 2''
    • 3''
    • 4''
    • 5''
    • 6''
    • Other
    Thickness

    0.25''

    • 0.25''
    • 0.125''
    • All
    • Other
    Bonding

    Yes

    • Yes
    • No
    • Other
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